Complete Physical Teardown of Tronics Microsystems's GYPRO3300 Angular Rate Sensor

Dublin, April 09, 2018 -- The "Tronics GYPRO3300 Angular Rate Sensor Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

Tronics Microsystems, a leader in high-performance MEMS inertial sensors, recently released a new high-performance MEMS gyroscope specially designed for industrial and other demanding applications: the Tronics GYPRO3300. The GYPRO3300 is a next-generation MEMS angular rate sensor that can determine angle changes in three dimensions for applications such as 3D mapping, robotics, AHRS, and navigation systems.

Hermetically sealed in a single CLCC 30-pin package, and with a volume under 850 mm3, the GYPRO3300 can be integrated in many advanced systems.

The GYPRO3300 gyroscope is a unique, high-performance z-axis with a sleek structure that includes MEMS and ASIC in a ceramic package, using Tronics vacuum wafer-level packaging (WLP) technology based on micro-machined, thick single-crystal silicon. Resistant to moisture, dust, and dirt, the GYPRO3300 was designed for high-stress conditions.

The MEMS structure is based on a tuning-fork design working in anti-phase mode to reject external vibration. This structure is coupled with an ASIC specifically designed by Si-Ware for MEMS gyroscopes.

The GYPRO3300 offers a new level of performance, with a bias instability below 1/h and a vibration rectification of 0.002/s/g, which is qualified for industrial applications. Si-Ware's ASIC embeds OTP memory, a temperature sensor, and a phase-locked loop to manage, compensate, and process data issued from the MEMS. Moreover, the system works in a close-loop architecture that brings key advantages.

This report analyzes the complete component, including the package, MEMS, and ASIC dies developed by Tronics Microsystems-TDK. Moreover, this report provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used.

Also included is a complete cost analysis and selling price estimate for the GYPRO3300 z-axis gyroscope, as well as a comparison with two other high-end MEMS gyroscopes: Sensonor's STIM210 Multi-Axis and Analog Devices' ADIS16136.

Key Topics Covered:

1. Overview /Introduction

2. Tronics Microsystems - Company Profile

3. Physical Analysis
Physical Analysis Methodology
Sensor Package
View and dimensions
Package opening
Sensor package cross-section
MEMS Die
MEMS cap : View and dimensions
MEMS sensing area
MEMS die cross-section
ASIC Die
ASIC die view and dimensions
ASIC delayering and main blocs
ASIC die cross-section

4. Manufacturing Process Flow
ASIC Process Characteristics
ASIC Wafer Fabrication Unit
MEMS Front-End Process
MEMS Wafer Fabrication Unit

5. Cost Analysis
Cost Analysis Overview
Main Steps Used in the Economic Analysis
Yield Hypotheses
MEMS/ASIC Die Cost
Front-end (FE) cost
Back-end - tests and dicing
Wafer and die cost
Component
Packaging cost
Component cost

Companies Mentioned

• Sensonor
• Tronics Microsystems

For more information about this report visit https://www.researchandmarkets.com/research/dknrpm/complete_physical?w=12

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