ICA Announces Unwinding of Equity Swap Involving OMA Shares
Jan 09, 2016 04:30 am UTC| Business
MEXICO CITY, Jan. 08, 2016 (GLOBE NEWSWIRE) -- Empresas ICA, S.AB. de C.V. (BMV:ICA) (NYSE:ICA), the largest infrastructure and construction company in Mexico, confirmed today the unwinding of an equity swap transaction...
Jan 09, 2016 03:00 am UTC| Business
NEW ORLEANS, Jan. 08, 2016 (GLOBE NEWSWIRE) -- Kahn Swick Foti, LLC ("KSF") and KSF partner, the former Attorney General of Louisiana, Charles C. Foti, Jr., remind investors that they have until March 7, 2016 to file...
Gainey McKenna & Egleston Announces a Class Action Lawsuit Has Been Filed Against KLX, Inc. (KLXI)
Jan 09, 2016 02:00 am UTC| Business
NEW YORK, Jan. 08, 2016 (GLOBE NEWSWIRE) -- Gainey McKenna Egleston announces that a class action lawsuit has been filed against KLX, Inc. (“KLX” or the “Company”) (Nasdaq:KLXI) in the United States District Court for...
Jan 09, 2016 00:39 am UTC| Business
CLEVELAND, Jan. 08, 2016 (GLOBE NEWSWIRE) -- Hickok Incorporated (OTC Pink:HICKA), a supplier of products and services for the automotive, emissions testing, locomotive, and aircraft industries, today announced the...
Northfield Bancorp Completes Merger With Hopewell Valley Community Bank
Jan 08, 2016 23:01 pm UTC| Business
WOODBRIDGE, N.J., Jan. 08, 2016 (GLOBE NEWSWIRE) -- Northfield Bancorp, Inc. (Nasdaq:NFBK) (“Northfield”), the holding company for Northfield Bank, announced today the closing of its acquisition of Hopewell Valley...
Rodan + Fields Announces Appointment of Diane Dietz as President and CEO
Jan 08, 2016 23:00 pm UTC| Business
SAN FRANCISCO, Jan. 08, 2016 (GLOBE NEWSWIRE) -- Rodan Fields, LLC (“Rodan + Fields”), a leading premium skincare brand and unique technology-driven social enterprise platform, today announced that its Board of...
PDF Solutions® Announces Fourth Fiscal Quarter and Year End 2015 Financial Results Release Date
Jan 08, 2016 22:21 pm UTC| Business
SAN JOSE, Calif., Jan. 08, 2016 (GLOBE NEWSWIRE) -- PDF Solutions, Inc. (Nasdaq:PDFS), the leading provider of process-design integration technologies to enhance IC manufacturability, announces the date and time that it...