Qualcomm and MediaTek are anticipated to reveal their latest flagship mobile SoCs that are expected to be named Snapdragon 898 and Dimensity 2000, respectively. Their core specifications might have been revealed in a recent leak, and the latter appears to have a slight advantage.
The latest information on the Snapdragon 898 and Dimensity 2000 comes from Weibo’s notable leaker Digital Chat Station. In a new post on the Chinese microblogging platform (translated via Google Translate), the tipster claims to have the “current sample parameters” for both chipsets.
Unsurprisingly, the flagship SoCs are rumored to be produced by different manufacturers. Qualcomm is expected to use Samsung’s 4nm process for the Snapdragon 898. MediaTek will also use a 4nm architecture for the Dimensity 2000, but its production will be reportedly handled by the Taiwan Semiconductor Manufacturing Company (TSMC).
Both Snapdragon 898 and Dimensity 2000 will purportedly feature a single core of Arm’s high-performance Cortex-X2 clocked at 3.0GHz. Arm introduced the Cortex-X2 last May and promised that it performs 16 percent faster than its predecessor Cortex X1, which is found on both the Snapdragon 888 and MediaTek 1200.
Qualcomm and MediaTek are not changing the architecture of their next flagship chipsets. They both have eight processing cores with a 1-3-4 design. The remaining cores of both chipsets are where the differences can be easily spotted.
The Snapdragon 898 reportedly sports three “big” cores clocked at 2.5GHz, while the Dimensity 2000 has a slightly better performance with three big cores” with 2.85GHz speed. MediaTek’s advantage in the “little” core is slimmer with four 1.8GHz cores compared to Qualcomm’s four 1.79GHz small cores. The companies are also anticipated to launch their new mobile GPUs namely Adreno 730 on Snapdragon and Mali-G710 MC10 on Dimensity.
Devices reportedly powered by the Snapdragon 898 have already leaked through Geekbench tests, suggesting that the SoC’s launch could be happening soon. Qualcomm held a launch event in December 2020 where the Snapdragon 888 was announced. It is then possible for the Snapdragon 898 to be announced before the end of the year.
Meanwhile, if MediaTek follows its previous timeline the Dimensity 2000 could be unveiled at a later time. This year, the company announced the Dimensity 1200, along with Dimensity 1100, in January.
Featured photo by Kārlis Dambrāns on Flickr licensed under Creative Commons (CC BY 2.0)


SK Hynix Labeled “Investment Warning Stock” After Extraordinary 200% Share Surge
Australia Enforces World-First Social Media Age Limit as Global Regulation Looms
China Adds Domestic AI Chips to Government Procurement List as U.S. Considers Easing Nvidia Export Curbs
SpaceX Reportedly Preparing Record-Breaking IPO Targeting $1.5 Trillion Valuation
Trump’s Approval of AI Chip Sales to China Triggers Bipartisan National Security Concerns
Australia’s Under-16 Social Media Ban Sparks Global Debate and Early Challenges
Moore Threads Stock Slides After Risk Warning Despite 600% Surge Since IPO
SK Hynix Considers U.S. ADR Listing to Boost Shareholder Value Amid Rising AI Chip Demand
Mizuho Raises Broadcom Price Target to $450 on Surging AI Chip Demand
Evercore Reaffirms Alphabet’s Search Dominance as AI Competition Intensifies
Taiwan Opposition Criticizes Plan to Block Chinese App Rednote Over Security Concerns
Trump Criticizes EU’s €120 Million Fine on Elon Musk’s X Platform
Adobe Strengthens AI Strategy Ahead of Q4 Earnings, Says Stifel
EssilorLuxottica Bets on AI-Powered Smart Glasses as Competition Intensifies
SK Hynix Shares Surge on Hopes for Upcoming ADR Issuance
SoftBank Shares Slide as Oracle’s AI Spending Plans Fuel Market Jitters 



