Intel and AMD Set for 2024 Motherboard Upgrades with New 800-Series and 700-Series

AMD and Intel motherboard partners expect the next-generation 700-series "AM5" and 800-series "LGA 1851" platforms to be available in Q3 2024.

According to Chinese board channel forums, which quote multiple motherboard partners and industry sources, the next big motherboard upgrade cycle will occur in Q3 2024, which is roughly a year away.

Both AMD and Intel are expected to release their next chipsets, which motherboard manufacturers will use in next-generation goods, but AMD will be flexible based on Intel's decisions because they aren't in a hurry, as we shall explain.

Motherboard Platform Intel 800-Series ‘LGA 1851’ For Arrow Lake-S CPUs and Beyond

Starting with Intel, the LGA 1700 socket is found on two generations of motherboards: the 600-series (Z690, H670, B660, H610) and the 700-series (Z790, B760, H710), as per WCCFTech. The motherboards support three CPU generations: 12th Gen Alder Lake, 13th Gen Raptor Lake, and the recently released 14th Gen Raptor Lake Refresh CPUs.

Motherboard manufacturers also revised their Z790 lineup slightly with new boards incorporating the most recent I/O features such as WIFI7 and BT5.3.

However, Intel intends to transition to a completely new platform in 2024. The next-generation 800-series boards will use the LGA 1851 socket, which will be introduced with the release of Arrow Lake-S Desktop CPUs in 2H 2024. The 800-series family will contain motherboards Z890, H860, and H810, as well as W880/Q870 chipsets for workstations and business devices.

According to previous reports, the Intel Z890 platform will have up to 60 HSIO channels (26 CPU + 34 PCH), while the B860 and H810 platforms will have 44 and 32 HSIO channels, respectively. Intel's 800-series platform will also support up to DDR5-6400 memory natively and with 48 GB memory module compatibility.

AMD 700-Series ‘AM5’ Motherboard Platform for Ryzen 7000, Ryzen 8000, and Future CPUs

Team Red and its motherboard partners will launch the new 700-series PCH family, which will be based on the same AM5 socket. AMD has committed to a 2025+ roadmap for its AM5 socket, and the launch of a new PCH does not imply that old motherboards will be supported any less than they are presently.

The new PCH will be designed to offer new and improved functions, but like with AM4, previous chipsets will retain compatibility with newer CPUs and may also receive support for the same features via BIOS updates from motherboard manufacturers.

The 700-series PCH will be an update to the 600-series (X670, B650, A620) and will be introduced alongside the next-generation AMD Ryzen 8000 "Granite Ridge" CPUs, which will employ the Zen 5-core architecture. According to reports, AMD is not in a rush to release the 700-series because the 600-series is sufficient for its next-generation CPU portfolio.

Furthermore, AMD has an advantage over Intel with its current platform, offering a robust Gen5 (GPU/SSD) ecosystem, so unless Intel makes massive upgrades with its 800-series, AMD may launch the Ryzen 8000 series on 600-series boards first, followed by 700-series boards for users who want something more.

It'll also be interesting to see if AMD's higher-end 700-series AM5 motherboards keep the dual PCH configuration seen on the X670 series or switch to a single PCH design. The switch to twin PCH (two B650 chipsets) was made to increase I/O capabilities.

AMD may develop a new PCH that eliminates the need for two PCHs and includes all of the added capabilities on a single device. We may anticipate stronger memory scaling capabilities through its motherboard partners, as well as next-generation interfaces like WIFI7, similar to Intel.

Both Intel and AMD's next-generation platforms will be available in Q3 2024, similar to the AMD Ryzen 7000 (AM5 600-series) and Intel 13th Gen (LGA 1700 700-series) launches in 2022.

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