Menu

Search

  |   Technology

Menu

  |   Technology

Search

Google's Tensor G4 Speculation Corrected: Not Exynos 2400 but a Unique Blend

Tensor G4: Google's Next-Gen Chip Diverges from Exynos 2400 Speculation

Google's earlier Tensor chipsets, which power the company's Pixel smartphone lineup and, more recently, a tablet, are in some way based on Samsung's past Exynos SoC introductions.

The Tensor G3's unique 9-core CPU cluster was most likely based on the Korean giant's unannounced Exynos 2300. Thus, it's very reasonable to think that the next Tensor G4 will share some similarities with the Exynos 2400.

Unfortunately, the disparity in specifications does not give us trust in this allegation, despite the fact that one tipster thinks it.

Google's Tensor G4 Is Based On Exynos 2400, A Tipster Claimed

For those who don't know, Samsung's Exynos 2400 has a 10-core CPU cluster. However, a Geekbench 5 leak revealed that the Tensor G4 has an 8-core CPU portion, with one fewer core than the Tensor G3.

Regardless, @OreXda believes that Google's next SoC for the Pixel 9 and Pixel 9 Pro is based on the Exynos 2400 and shares a few characteristics but most likely overlooked the variances between the two silicons.

Even the GPUs of the Tensor G4 and Exynos 2400 are vastly different, with the latter sporting an Xclipse 940 graphics processor based on AMD's RDNA3 architecture. In contrast, the Tensor is seen to house ARM's Immortalis-G715, which stays unmodified from the Tensor G3.

Tipster Corrects Tensor G4 Specs: Insights on Google's Semi-Custom Approach with ARM Designs

Fortunately, the tipster recognized the inaccuracy in his assertions and remarked on the thread that the Tensor G4 might be a semi-custom SoC, with Google leveraging ARM's current CPU and GPU designs, as per WCCFTech.

@OreXda may have meant that the Tensor G4 is based on the Exynos 2400 because it uses several fabrication and packaging technologies that Samsung announced this year.

This features the more efficient 4LPP+ process and “Fan-out Wafer Level Packaging” (FOWLP), which reduces heat resistance. This allows smartphone silicon to sustain temperatures while achieving excellent multi-core scores. We also previously stated that the Tensor G4 would be a small update to its predecessor.

Photo: 9To5Google/YouTube Screenshot

  • Market Data
Close

Welcome to EconoTimes

Sign up for daily updates for the most important
stories unfolding in the global economy.