Silicon Sensing CMS300 - Reverse Costing Analysis

Dublin, Feb. 29, 2016 -- Research and Markets (http://www.researchandmarkets.com/research/xv44pp/silicon_sensing) has announced the addition of the "Silicon Sensing CMS300 - Reverse Costing Analysis" report to their offering.

Silicon Sensing CMS300 is a combo sensor device used in automotive and industrial applications. The CMS300 presents a unique Gyro ring structure covered by piezoelectric film actuator/ transducers and suspended on the ASIC die by a pedestal. The accelerometer has a very specific structure with glass layers and TGV to compact the final size.

Silicon Sensing CMS300 is part of the Orion Family combined accelerometer and gyroscope sensor devices used in tough environments. The component has excellent bias over temperature, high shock and vibration rejection and combines single-axis angular rate and dual-axis linear acceleration measurement.

Silicon Sensing proposes a 10.4×6.0x2.18mm device. The device presents one ASIC, one MEMS GYRO and one MEMS ACCELERO stacked on a ceramic substrate and connected by wire bonding.

The CMS300 features independent acceleration and angular rate sensing elements designed by Silicon Sensing and manufactured in Sumitomo Precision Products fab in Amagasaki, Japan.

The Gyroscope is a unique patented ring manufactured using DRIE Bulk process and composed of piezoelectric film actuators/transducers. The accelerometer element consists of one-piece resonating silicon MEMS structure anodically bonded to top and bottom glass substrates and connected by TGV (Through Glass Vias). A single ASIC produced with an CMOS 0.35µm process is used.

The report includes a comparison with Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer.

Key Topics Covered:

1. Introduction

2. Physical Analysis
- Physical Analysis Methodology
- Package
- Package Characteristics Marking & Pin-out
- Package Opening
- Package Bonding
- Package Cross-Section
- ASIC Die
- View, Dimensions & Marking
- Delayering & Process Identification
- Cross-Section
- MEMS Accelero Die
- View, Dimensions & Marking
- MEMS TGV
- MEMS Cross-Section
- Process Characteristics
- Silicon Sensing Patents
- MEMS Gyro Die
- View, Dimensions & Marking
- MEMS Piezoelectric film
- MEMS Pedestal
- Cross-Section
- Process Characteristics
- Silicon Sensing Patents

3. Comparison with Murata's SCC2000

4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

5. Cost Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Probe Test & Dicing Cost
- ASIC Wafer & Die Cost
- MEMS Gyro Front-End Cost
- MEMS Gyro Front-End Cost per process steps
- MEMS Gyro Probe Test & Dicing Cost
- MEMS Gyro Wafer & Die Cost
- MEMS Accelero Front-End Cost
- MEMS Accelero Front-End Cost per process steps
- MEMS Accelero Probe Test & Dicing Cost
- MEMS Accelero Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- CMS300 Component Cost

6. Price Analysis
- Definition of Prices
- CMS300 Selling Price Estimation

For more information visit http://www.researchandmarkets.com/research/xv44pp/silicon_sensing

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