PITTSBURGH, March 20, 2017 -- II‐VI Incorporated (NASDAQ:IIVI), a global leader in engineered materials and optical solutions for networks, will exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) in Los Angeles, California, on March 21-23, 2017, in Booth #2101.
II-VI is increasingly leveraging its innovation leadership in its semiconductor and micro-optics technology platforms to create the next set of breakthroughs in miniaturized solutions. These will enable novel monitoring solutions for transport networks, compact amplifier solutions for high bit-rate DWDM transceivers, as well as key devices and sub-assemblies for datacenter transceivers. The new products showcased at OFC include the following:
- 3-pin 980 nm micro-pump laser: II-VI achieves a new breakthrough in miniaturization with its 980 nm micro-pump laser that measures only 141 cubic millimeters in volume to enable optical amplification within emerging small pluggable transceiver packages.
- Miniature MEMS tunable optical filter (mini-MTOF) with variable optical attenuator (VOA): The new mini-MTOF filters out optical noise to improve the signal fidelity in high bit rate transmission. Its low 4.8 mm profile fits in pluggable module form factors and the VOA function removes the need for a separate device.
- Pluggable Optical Time Domain Reflectometer (OTDR): II-VI’s pluggable OTDR is a new module designed for embedded network monitoring applications in carrier and data center networks to monitor fiber plant quality.
- 25 Gb/s detector chip array: II-VI’s newly developed 25 Gb/s detector chips enable 100 Gb/s short-reach transmission in active optical cables and transceivers. The high speed detectors feature large 40 µm diameter apertures that greatly facilitate arrayed-receiver assembly manufacturing.
- Z-block mux/demux micro-optics assembly: Designed for 100 Gb/s datacenter transceivers, the Z-block is a new micro-optics precision mux/demux assembly in an extremely small 1.5 x 1.0 x 1.35 mm size that fits in a standard CFP4 or QSFP package.
About II-VI Incorporated
II-VI Incorporated, a global leader in engineered materials and opto-electronic components is a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Headquartered in Saxonburg, Pennsylvania, with research and development, manufacturing, sales, service, and distribution facilities worldwide, the Company produces a wide variety of application-specific photonic and electronic materials and components, and deploys them in various forms including integrated with advanced software to enable our customers.
CONTACT: Mark Lourie Director, Corporate Communications [email protected] www.ii-vi.com


Trump Pushes $100 Billion U.S. Oil Investment Plan for Venezuela After Maduro Seizure
xAI Cash Burn Highlights the High Cost of Competing in Generative AI
Elon Musk Says X Will Open-Source Its Algorithm Amid EU Scrutiny
Allegiant to Acquire Sun Country Airlines in $1.5 Billion Deal to Expand U.S. Leisure Travel Network
AustralianSuper Backs BlueScope Steel’s Rejection of $9 Billion Takeover Bid
GM Takes $6 Billion EV Write-Down as Electric Vehicle Demand Slows in the U.S.
FCC Approves Expansion of SpaceX Starlink Network With 7,500 New Satellites
Walmart to Join Nasdaq-100 Index as It Replaces AstraZeneca Following Exchange Move
Anthropic Launches HIPAA-Compliant Healthcare Tools for Claude AI Amid Growing Competition
FTC Blocks Edwards Lifesciences’ JenaValve Acquisition in Major Antitrust Ruling
SK Hynix Shares Hit Record High as AI Memory Demand Fuels Semiconductor Rally
UBS Upgrades L’Oréal to Buy, Sees Strong Sales Momentum and 20% Upside
Stellantis to End Plug-In Hybrid Sales in the U.S. as Demand Shifts Toward Traditional Hybrids
Chevron Sees Path to Boost Venezuela Oil Output by 50% After Trump Administration Talks
Trump Calls for 10% Credit Card Interest Rate Cap Starting 2026
China’s AI Sector Pushes to Close U.S. Tech Gap Amid Chipmaking Challenges 



