ALHAMBRA, Calif., March 21, 2016 -- EMCORE Corporation (NASDAQ:EMKR), a leading provider of Indium Phosphide (InP) optical chips, components, subsystems and systems for the broadband and specialty fiber optics market, announced today the introduction of the MEDALLION 6100 Series DOCSIS 3.1 1550 nm Externally-Modulated CATV Transmitter. The MEDALLION 6100 will be on display at the Optical Fiber Conference (OFC) in booth #1228 at the Anaheim Convention Center, March 22–24, and also at the China Content Broadcasting Network (CCBN) show at the China International Exhibition Center in Beijing, China, March 24–26.
The MEDALLION 6100 series of externally-modulated CATV transmitters represents the next level of evolution of the successful and widely deployed MEDALLION 6000 series. The use of EMCORE’s advanced low noise, high optical output power and narrow optical linewidth laser results in unmatched fiber optic transmission link performance. The transmitter supports the DOCSIS 3.1 standard of 1.2 GHz in the CATV domain, and optionally up to 3.5 GHz in the SAT-IF band to support new international satellite deployments. Gain tilt control is now available for both the CATV and SAT-IF band. In parallel, the MEDALLION 6100 boasts a number of platform upgrades including the addition of a USB port for local communication, a 1000BaseT Ethernet port with an on board 4-port Ethernet switch, support for IPv4/IPv6, and SNMPv3 for advanced services.
EMCORE’s MEDALLION 6100 transmitters leverage proprietary pre-distortion circuitry to provide superior CSO (Composite Second Order) and CTB (Composite Triple Beat) performance allowing links up to 150 km making it ideally suited for extending traditional hybrid fiber coaxial CATV systems. Additionally, SBS (Stimulated Brillouin Scattering) suppression levels greater than 21 dBm through 40 km of fiber makes the MEDALLION 6100 series ideal for RFoG (Radio Frequency over Glass) and RF overlay in FTTx networks in countries around the world.
“Our MEDALLION series of rack-mount CATV transmission equipment is ideal for network systems providers that demand the highest-quality, economical delivery of High- and Ultra-High-Definition video and audio, along with the highest bandwidth data transmission for their customers,” said Gyo Shinozaki, Vice President of Marketing at EMCORE. “The MEDALLION 6100 transmitters extends bandwidth for DOCSIS 3.1 compatibility, while adding advanced platform features to support cable operators as they migrate their networks to the latest technology,” added Shinozaki.
At OFC and CCBN, EMCORE will be also showcasing its chip level devices portfolio for Telecom, GPON FTTx, Datacom and Wireless applications including 1310, 1490 and 1550 nm laser diode chips, 10G Fabry-Perot laser chips, and 2.5G and 10G APD photodetectors. In addition, EMCORE will be featuring its full line of Distributed Feedback (DFB) butterfly lasers, DOCSIS 3.1 lasers, TO-56 lasers, low-noise optical receivers, broadband photodiodes and components for wireless and Distributed Antenna System (DAS) applications.
EMCORE will be meeting with customers, industry analysts and the media at our booth #1228 and we invite you to contact us if you would like to schedule a meeting.
About EMCORE
EMCORE Corporation designs and manufactures Indium Phosphide (InP) optical chips, components, subsystems and systems for the broadband and specialty fiber optics market. EMCORE was the pioneer in linear fiber optic transmission technology, and today is a leader in optical components, as well as a provider of complete end-to-end solutions for high-speed communications network infrastructures, enabling systems and service providers to meet growing demand for bandwidth and connectivity. EMCORE’s advanced optical technologies are designed for cable television (CATV) and fiber-to-the-premise (FTTP) networks, telecommunications and data centers, satellite communications, aerospace and defense, wireless networks, and broadcast and professional audio/video systems. With its world-class InP semiconductor wafer fabrication facility, EMCORE has fully vertically-integrated manufacturing capability and also provides contract design, foundry and component packaging services. EMCORE is headquartered in Alhambra, California, USA with InP wafer fabrication operations in Alhambra, and ISO 9001 certified manufacturing in Alhambra and Langfang, China. For further information, please visit http://www.emcore.com.
Forward-looking statements:
The information provided herein may include forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding EMCORE's expectations, goals or intentions, including, but not limited to, financial performance, production schedules, expected customer sales, product features and their benefits, product quality and product performance. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about EMCORE and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. Risks and uncertainties that could cause EMCORE's actual results to differ from those set forth in any forward-looking statement are discussed in more detail in EMCORE's SEC filings available at www.sec.gov, including under the headings "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations." Forward-looking statements contained in this press release are made only as of the date hereof, and EMCORE undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.
Contact: EMCORE Corporation Gyo Shinozaki Vice President of Marketing (626) 293-3616 [email protected] Investor Mark Weinswig (626) 293-3400 [email protected] Media Joel Counter Manager, Corporate Marketing Communications (626) 999-7017 [email protected]


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