AMD CEO Lisa Su Heads to Samsung's South Korea Chip Facility Amid AI Expansion Talks

Advanced Micro Devices CEO Lisa Su is scheduled to visit Samsung Electronics' semiconductor manufacturing complex in Pyeongtaek, South Korea, marking a significant step in deepening the two companies' strategic partnership. According to a source familiar with the trip who requested anonymity given the sensitive nature of the visit, Su will tour active chip production lines and engage in high-level discussions about broadening collaboration beyond memory chips into foundry manufacturing services.

During the visit, Su is expected to meet with key Samsung semiconductor executives, including Jun Young-hyun, who leads the company's chip division, and Han Jin-man, the head of Samsung's Foundry Business. These discussions signal AMD's growing interest in diversifying its chip manufacturing relationships as demand for AI-accelerated computing continues to surge globally.

The visit builds on an already established partnership between AMD and Samsung. Samsung has been a supplier of High Bandwidth Memory 3E chips, commonly known as HBM3E, powering AMD's latest generation of artificial intelligence accelerators. This existing memory chip relationship has laid a strong foundation for the two companies to explore expanded cooperation across Samsung's broader semiconductor ecosystem.

Beyond the factory tour and executive meetings, Su is also expected to sit down for a private dinner with Samsung Electronics Chairman Jay Y. Lee, underscoring the strategic weight both companies place on this evolving relationship. A chairman-level engagement of this kind typically signals that deeper, long-term agreements may be on the horizon.

AMD did not respond to requests for comment made outside regular business hours, while Samsung Electronics formally declined to comment on the matter. As the AI chip market grows increasingly competitive, partnerships between leading chip designers and top-tier foundry operators are becoming critical to securing supply chain resilience and next-generation manufacturing capabilities.