Samsung Accelerates Digital Twin Tech To Enhance Chip Manufacturing Efficiency

Samsung Electronics Co. is accelerating its ‘digital twin’ technology development to improve efficiency in semiconductor manufacturing.

Digital twin technology involves using artificial intelligence (AI) and big data to analyze and forecast various scenarios, creating virtual replicas of real-world objects.

Samsung’s Device Solution (DS) division recently appointed Executive Vice President Lee Young-woong was as the head of the Digital Twin Task Force, which was established as part of an organizational reshuffle late last year.

Lee, an MIT graduate, previously held positions in technology integration and robotics at General Electric Co. and Shell PLC.

Meanwhile, the production lines for semiconductor circuits become more complex as the circuits become smaller, requiring an increase in equipment.

Samsung and Leewould explore methods for efficient management of semiconductor factories, focusing on defect prediction through digital twin and digital transformation (DX) technology while enhancing potential.