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Broadcom Eyes $35 Billion AI Chip Financing Deal With Apollo and Blackstone

Broadcom Eyes $35 Billion AI Chip Financing Deal With Apollo and Blackstone.

Broadcom Inc. is reportedly in discussions with Apollo Global Management and Blackstone Inc. to secure around $35 billion in financing for its expanding artificial intelligence chip business, according to a Bloomberg report published Friday. If finalized, the agreement would rank among the largest private credit deals ever completed in the technology sector.

The funding is expected to help Broadcom accelerate the development and production of advanced AI chips used in data centers and large-scale artificial intelligence systems. Demand for AI infrastructure has surged as major tech companies continue investing heavily in machine learning and generative AI technologies.

The terms of the proposed financing package are still being negotiated, and details could change before a final agreement is reached. Neither Broadcom nor the investment firms have publicly confirmed the transaction.

Broadcom has recently strengthened its position in the AI semiconductor market through several major partnerships. Earlier this year, the company revealed a long-term agreement with Google to develop and supply custom tensor processing units (TPUs). Broadcom will also provide networking hardware and related components for Google’s next-generation AI rack systems through 2031.

In addition, Broadcom expanded its collaboration with Google and AI startup Anthropic. The partnership is expected to provide Anthropic with access to an additional 3.5 gigawatts of TPU-based AI computing capacity beginning in 2027, subject to the company’s ongoing commercial growth. Broadcom previously stated that discussions with financial partners were underway to support the large-scale deployment of this AI infrastructure.

The potential deal highlights growing investor interest in artificial intelligence infrastructure financing. Last year, Meta Platforms secured nearly $30 billion in funding from Blue Owl Capital and Pacific Investment Management Co. to support the construction of a major data center facility in Louisiana.

As competition in the AI chip market intensifies, Broadcom continues positioning itself as a key supplier for the next generation of AI computing systems in 2026.

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