Global Markets Slide as AI, Crypto, and Precious Metals Face Heightened Volatility 
Nvidia Confirms Major OpenAI Investment Amid AI Funding Race 
Gold Prices Slide Below $5,000 as Strong Dollar and Central Bank Outlook Weigh on Metals 
Japan Economy Poised for Q4 2025 Growth as Investment and Consumption Hold Firm 
India–U.S. Interim Trade Pact Cuts Auto Tariffs but Leaves Tesla Out 
SpaceX Seeks FCC Approval for Massive Solar-Powered Satellite Network to Support AI Data Centers 
Trump’s Inflation Claims Clash With Voters’ Cost-of-Living Reality 
Nvidia Nears $20 Billion OpenAI Investment as AI Funding Race Intensifies 
Tencent Shares Slide After WeChat Restricts YuanBao AI Promotional Links 
Hims & Hers Halts Compounded Semaglutide Pill After FDA Warning 
Baidu Approves $5 Billion Share Buyback and Plans First-Ever Dividend in 2026 
Nvidia, ByteDance, and the U.S.-China AI Chip Standoff Over H200 Exports 
South Africa Eyes ECB Repo Lines as Inflation Eases and Rate Cuts Loom 
OpenAI Expands Enterprise AI Strategy With Major Hiring Push Ahead of New Business Offering 
Trump Backs Nexstar–Tegna Merger Amid Shifting U.S. Media Landscape 
Google Cloud and Liberty Global Forge Strategic AI Partnership to Transform European Telecom Services 
Dollar Near Two-Week High as Stock Rout, AI Concerns and Global Events Drive Market Volatility 
Samsung Electro-Mechanics Co. had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA), a substrate for high-performance self-driving systems.
FCBGA is among those with the highest technological levels for automotive electronics.
Samsung Electro-Mechanics applied its microcircuit technology from the areas of high-end IT products, such as servers for automotive electronics, to reduce circuit width and spacing by 20 percent comparedf to existing substrates for partial driving automation.
Accordingly, over 10,000 bumps were realized in a passport photo-sized space.
Samsung Electro-Mechanics also improved flexural strength to cope with multi-chip packages in which several chips are mounted on a single substrate at the same time.
