Global Microelectromechanical Systems (MEMS) Market 2018-2022 with Broadcom, Robert Bosch, STMicroelectronics & Texas Instruments Dominating

Dublin, March 22, 2018 -- The "Global Microelectromechanical Systems (MEMS) Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.

The global microelectromechanical systems (MEMS) market to grow at a CAGR of 9.41% during the period 2018-2022.

Global Microelectromechanical Systems (MEMS) Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in the market is adoption of sensor fusion. Sensor fusion is the combination of the sensory inputs derived from distinct sources to provide a highly accurate result, which cannot be provided by a single standalone sensor. To achieve sensor fusion, there is a need for extensive technical algorithms that can allow the integration of different sensors and obtain a single output. Kalman filtering is one of the main algorithms used.

According to the report, one driver in the market is reduction in the ASP. One of the major drivers for the growth of the global MEMS market is the declining ASP of different types of MEMS.

Further, the report states that one challenge in the market is price wars. A major challenge faced by the global MEMS market is the intense competition that exists in the market. There is a well-diversified list of international and domestic vendors. Since several vendors exist in the market, it results in the reduction of the profit margins of the companies.

Key vendors

• Broadcom
• Robert Bosch
• STMicroelectronics
• Texas Instruments

Key questions answered in this report

• What will the market size be in 2022 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

• Market ecosystem
• Global semiconductor market
• Functional elements of MEMS
• MEMS manufacturing technologies
• Types of MEMS
• Market characteristics
• Market segmentation analysis

PART 05: MARKET SIZING

• Market definition
• Market sizing 2017
• Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

PART 07: MARKET SEGMENTATION BY PRODUCT

• Segmentation by product
• Comparison by product
• Pressure sensor - Market size and forecast 2017-2022
• Gyroscope - Market size and forecast 2017-2022
• RF MEMS - Market size and forecast 2017-2022
• Accelerometer - Market size and forecast 2017-2022
• Inertial combo - Market size and forecast 2017-2022
• Microphone - Market size and forecast 2017-2022
• Optical MEMS - Market size and forecast 2017-2022
• Microfluidic - Market size and forecast 2017-2022
• Others - Market size and forecast 2017-2022
• Market opportunity by product

PART 08: MARKET SEGMENTATION BY APPLICATION

• Segmentation by application
• Comparison by application
• Consumer electronics - Market size and forecast 2017-2022
• Automotive - Market size and forecast 2017-2022
• Industrial - Market size and forecast 2017-2022
• Healthcare - Market size and forecast 2017-2022
• Aerospace and defense - Market size and forecast 2017-2022
• Others
• Market opportunity by application

PART 09: CUSTOMER LANDSCAPE

PART 10: REGIONAL LANDSCAPE

• Geographical segmentation
• Regional comparison
• APAC - Market size and forecast 2017-2022
• EMEA - Market size and forecast 2017-2022
• Americas - Market size and forecast 2017-2022
• Market opportunity by region

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

• Market drivers
• Market challenges

PART 13: MARKET TRENDS

• Adoption of sensor fusion
• Growth of piezoelectric MEMS
• Increasing interest in NEMS
• Increasing interest in larger wafer sizes

PART 14: VENDOR LANDSCAPE

• Overview
• Landscape disruption
• Competitive scenario

PART 15: VENDOR ANALYSIS

• Vendors covered
• Vendor classification
• Market positioning of vendors
• Broadcom
• Qorvo
• Robert Bosch
• STMicroelectronics
• Texas Instruments
• Other prominent vendors

PART 16: APPENDIX

For more information about this report visit https://www.researchandmarkets.com/research/8hmt42/global?w=12

CONTACT: ResearchAndMarkets.com
         Laura Wood, Senior Manager
         [email protected]
         For E.S.T Office Hours Call 1-917-300-0470
         For U.S./CAN Toll Free Call 1-800-526-8630
         For GMT Office Hours Call +353-1-416-8900
         Related Topics: Microelectromechanical Systems (MEMS)