Nvidia Locks in 70% of TSMC’s Advanced Chip Packaging for 2025 Amid AI Boom

Nvidia (NASDAQ: NVDA) has secured over 70% of Taiwan Semiconductor Manufacturing Co.'s (NYSE: TSM) advanced chip packaging capacity for 2025, as AI-driven demand for high-performance chips surges, Taiwanese media reported.

According to Economic Daily, citing industry sources, demand for Nvidia’s next-generation Blackwell AI chips remains strong, prompting the firm to contract the majority of TSMC’s Chip on Wafer on Substrate (CoWoS) with silicon interposer capacity. TSMC’s Taiwan-listed shares recovered some losses after the report.

TSMC, the world’s largest contract chipmaker, is currently the only major supplier of advanced chip packaging—a critical process that integrates multiple semiconductors into a single device. Late last year, reports indicated that Nvidia had already secured at least 60% of this capacity for 2025.

Tech giants Microsoft (NASDAQ: MSFT), Google (NASDAQ: GOOGL), Meta (NASDAQ: META), and Amazon (NASDAQ: AMZN) continue to ramp up spending on AI infrastructure, fueling demand for Nvidia’s AI chips. This trend is expected to benefit TSMC, which reported strong Q4 earnings and plans to expand manufacturing and packaging operations in 2025 to keep up with AI-driven growth.

Additionally, TSMC stands to gain from the U.S. government’s push to strengthen domestic AI infrastructure.

The report comes just ahead of Nvidia’s highly anticipated fourth-quarter earnings release on Wednesday, which investors will closely watch for insights into the broader AI and semiconductor market.

Neither Nvidia nor TSMC has commented on the report.