ALMERE, The Netherlands, July 7, 2016 -- ASM International N.V. (Euronext Amsterdam: ASM) today announces that it will be hosting an analyst and investor technology briefing on Wednesday, July 13, 2016 at 8:00 - 9:30 a.m. (PDT) in San Francisco, US, coinciding with SEMICON West 2016. The presentation will be held in room 256, Mezzanine level - West side, Moscone Center.
In this technology seminar Han Westendorp, Vice President Corporate Marketing, will present "Advanced chip manufacturing with new materials". The presentation will include highlights of ASM's advanced ALD (Atomic Layer Deposition) products and technologies, as well as ASM's CVD, PECVD and epitaxy technologies.
The room will open at 7:30 am for invited attendees. Interested parties should contact Ivette van Eijkelenburg, +31 88 100 8570, [email protected].
About ASM International
ASM International NV, headquartered in Almere, the Netherlands, its subsidiaries and participations design and manufacture equipment and materials used to produce semiconductor devices. ASM International, its subsidiaries and participations provide production solutions for wafer processing (Front-end segment) as well as for assembly & packaging and surface mount technology (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's website at www.asm.com.
Cautionary Note Regarding Forward-Looking Statements: All matters discussed in this press release, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, corporate transactions, financing and liquidity matters, the success of restructurings, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholders or other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company's reports and financial statements. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.
CONTACT
Investor contact:
Victor Bareño
T: +31 88 100 8500
ASMI to Host Analyst and Investor Technology Seminar http://hugin.info/132090/R/2027032/753310.pdf
HUG#2027032


TrumpRx Website Launches to Offer Discounted Prescription Drugs for Cash-Paying Americans
Nvidia, ByteDance, and the U.S.-China AI Chip Standoff Over H200 Exports
Nvidia Nears $20 Billion OpenAI Investment as AI Funding Race Intensifies
FDA Targets Hims & Hers Over $49 Weight-Loss Pill, Raising Legal and Safety Concerns
Australian Scandium Project Backed by Richard Friedland Poised to Support U.S. Critical Minerals Stockpile
Alphabet’s Massive AI Spending Surge Signals Confidence in Google’s Growth Engine
Missouri Judge Dismisses Lawsuit Challenging Starbucks’ Diversity and Inclusion Policies
OpenAI Expands Enterprise AI Strategy With Major Hiring Push Ahead of New Business Offering
SpaceX Pushes for Early Stock Index Inclusion Ahead of Potential Record-Breaking IPO
Uber Ordered to Pay $8.5 Million in Bellwether Sexual Assault Lawsuit
Nasdaq Proposes Fast-Track Rule to Accelerate Index Inclusion for Major New Listings
Instagram Outage Disrupts Thousands of U.S. Users
Amazon Stock Rebounds After Earnings as $200B Capex Plan Sparks AI Spending Debate
Global PC Makers Eye Chinese Memory Chip Suppliers Amid Ongoing Supply Crunch
Ford and Geely Explore Strategic Manufacturing Partnership in Europe
Sony Q3 Profit Jumps on Gaming and Image Sensors, Full-Year Outlook Raised
Nintendo Shares Slide After Earnings Miss Raises Switch 2 Margin Concerns 



