China Semiconductor Packaging and Test Market to Grow by 7.05% CAGR over Five Years - Market Analysis & Forecast 2015-2019

Monday, December 7, 2015 8:48 AM UTC

Dublin, Dec. 07, 2015 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/4jtb2s/semiconductor) has announced the addition of the "Semiconductor Packaging and Test Market in China 2015-2019" report to their offering.

Key Topics Covered:

The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:

IDM (integrated devices manufacturers)
Outsourced semiconductor assembly and test (OSAT)

The report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market. The report forecasts the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.

Questions Answered:

What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be?
What are the key Market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?

Companies Mentioned:

Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
STATS ChipPAC
UTAC
ChipMos
Greatek
Huahong
JCET
KYEC
Lingsen Precision
Nepes
SMIC
Tianshui Huatian
Unisem

Report Structure

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by business type

PART 07: Market drivers

PART 08: Impact of drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

PART 13: Key vendor analysis

PART 14: Appendix

PART 15: About the Author

For more information visit http://www.researchandmarkets.com/research/4jtb2s/semiconductor


CONTACT: Research and Markets
         Laura Wood, Senior Manager
         [email protected]

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         U.S. Fax: 646-607-1907
         Fax (outside U.S.): +353-1-481-1716

         Sector: Semiconductor

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China Semiconductor Packaging and Test Market to Grow by 7.05% CAGR over Five Years - Market Analysis & Forecast 2015-2019

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