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SK hynix, Samsung Electronics, and several other chip giants have partnered with South Korea’s Ministry of Industry, signing an MOU to enhance technology in advanced semiconductor packaging, aiming to lead the global market.
According to Yonhap News Agency, under the agreement, SK hynix, Samsung Electronics and others will cooperate with the government and work together to create superior technologies in the field of advanced semiconductor packaging. In addition, the country’s Ministry of Trade, Industry and Energy (MOTIE) said the partnership with major chipmakers is also aimed at helping nurture the companies in the last phases of chip production.
SK hynix, Samsung, and LG Chem signed the deal with MOTIE. It was reported that the ministry also signed up several outsourced semiconductor assembly and test companies and fabless firms.
The Korean administration brought up this project, pushing for new research and development projects in the advanced packaging and system semiconductor industry. The ultimate goal of the cooperation is to lead the global market.
Hankyung News reported that the directors of SK hynix and Samsung Electronics’ materials, part, and equipment units had attended the signing ceremony for the deal. The agency mentioned that Simmtech and Protech companies were among the companies in attendance in addition to the major names. The head of MOTIE’s industrial policy office, Joo Young Joon, led the event at the ministry’s Melon Hall, El Tower, located in Seocho-gu, Seoul, on Tuesday, Aug. 29.
Finally, all the parties involved in the agreement are expected to set up a new research and development (R&D) for advanced packaging. The government agency is also in the process of preparing for a large-scale R&D project that will be participated in by experts from various related industries, academia, and research institutes.
Photo by: MOTIE Press Release
