Samsung considers setting up chip packaging test line in Japan

South Korea's Samsung Electronics is looking to set up a chip packaging test line in Japan to bolster its advanced packaging business and forge closer ties with Japanese semiconductor equipment and materials makers of .

It would be the first such test line in Japan for Samsung and comes as the US increasingly urges allies to collaborate in countering China's rising might in chips and advanced technology.

Japan announced that it would restrict exports of 23 types of chip-making tools and align its technology trade controls with a US effort to curb China's chip-making ability.

Samsung is looking to establish the facility in Kanagawa prefecture, near Tokyo, where it already has a research and development center.

The investment would likely be $75 million.

Deliberations were still in an early stage, adding that the South Korean company was considering various options and nothing had been decided.