Samsung Electronics and five affiliates are investing a combined $1 billion in Helix Digital Infrastructure, a new artificial intelligence infrastructure company backed by investment firm KKR, as Samsung expands deeper into AI data centers, power systems and connectivity.
Samsung Electronics will contribute $500 million to the investment, while Samsung C&T, Samsung SDS, Samsung SDI, Samsung Life Insurance and Samsung Fire & Marine Insurance will provide the remaining $500 million.
Helix Digital Infrastructure was launched in June with KKR, the Kuwait Investment Authority, Nvidia and U.S. energy company Vistra among its founding investors. Led by former Amazon Web Services CEO Adam Selipsky, Helix aims to build infrastructure supporting the entire AI ecosystem.
Its focus includes hyperscale data centers, power generation, electricity transmission and distribution, and fiber-optic networks. Helix has identified access to sufficient electricity as one of the biggest constraints facing the rapidly expanding AI infrastructure market. The company plans to secure additional power capacity through direct investments and partnerships with energy developers, including Vistra.
Samsung's investment could also create opportunities for its affiliates to combine their expertise across several parts of the AI data-center supply chain.
Samsung Electronics already supplies semiconductor products used in AI computing. Its Device eXperience division also has exposure to data-center cooling through FläktGroup, which Samsung acquired in 2025.
Samsung C&T provides engineering, procurement and construction services for data centers and power projects. Samsung SDS designs and operates data centers and has expanded into the GPU-as-a-service market.
Meanwhile, Samsung SDI supplies uninterruptible power systems and battery backup solutions for data centers and plans to explore further opportunities as AI-related electricity demand grows.
Samsung said the Helix investment is intended to support the global expansion of AI data centers while creating a platform where its affiliates can combine semiconductor, engineering, cooling, energy and digital infrastructure capabilities.


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