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Samsung Electro-Mechanics Co. had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA), a substrate for high-performance self-driving systems.
FCBGA is among those with the highest technological levels for automotive electronics.
Samsung Electro-Mechanics applied its microcircuit technology from the areas of high-end IT products, such as servers for automotive electronics, to reduce circuit width and spacing by 20 percent comparedf to existing substrates for partial driving automation.
Accordingly, over 10,000 bumps were realized in a passport photo-sized space.
Samsung Electro-Mechanics also improved flexural strength to cope with multi-chip packages in which several chips are mounted on a single substrate at the same time.
