Huawei Set to Unveil Mate 70 in October, Featuring New Kirin Chip and Enhanced Camera

In a strategic move to extend its market lead, Huawei plans to launch the Mate 70 series this October. Although specific details remain undisclosed, the latest iteration promises a superior Kirin processor and enhanced imaging capabilities.

Huawei Gears Up for October Release of Mate 70 with Upgraded Kirin SoC and Advanced Camera Tech

According to a source (via Wccftech), while waiting for the official launch of the P70 series, Huawei is expected to introduce the Mate 70, the direct successor to the Mate 60 lineup, later this year.

The business is expected to reveal the new models in October, with highlights including an enhanced Kirin chipset and greater photographic capabilities. Unfortunately, in-depth details about the SoC have yet to be revealed, but based on Huawei's current efforts, it could be its most advanced silicon to date.

Huawei's Mate 60 series introduction last year was a triumph, largely thanks to its Kirin 9000S chipset, and the company is poised to maintain that momentum with the Mate 70 announcement. A source previously revealed that the P70 family will come alongside the Kirin 9010.

However, given that its moniker is similar to the Kirin 9000S, it could be a slightly modified version. This suggests that a completely new SoC could be released alongside the Mate 70, and previous sources suggest that it could be Huawei's and SMIC's first 5nm part.

Huawei to Boost Mate 70 Production, Shifts Entirely to HarmonyOS Amid Advanced Chip Development Challenges

According to CnBeta, the Mate 70's upgrades will completely replace Android with Huawei's HarmonyOS. Because Huawei does not ship its handsets outside of China, this will have little impact on the user experience, as customers will rely on local apps and services rather than Google's. It is also believed that Huawei intends to have a higher shipment volume of the Mate 70 than the Mate 60.

This could suggest that Huawei and SMIC will collaborate to secure a consistent supply of chips for the upcoming models. China's largest semiconductor manufacturer was earlier said to be setting up 5nm production lines for Huawei's next Kirin chipset, with commercialization likely beginning later this year.

Unfortunately, the company will rely on older DUV equipment to accomplish this, which may result in 5nm wafers being 50% more expensive than TSMC wafers using the same lithography.

Furthermore, using previous-generation gear rather than cutting-edge EUV technology increases the likelihood of poorer wafer yields. Still, it should be worthwhile if it allows Huawei to deliver an innovative chipset for the Mate 70 series while reducing its reliance on foreign companies.

The former Chinese behemoth reportedly invests around $1.66 billion in a chip R&D facility. However, whether the facility will permit mass assembly of future Kirin chipsets is unclear. It appears to have to wait until October for further details.

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