LOS ALTOS, Calif., April 11, 2018 -- DSP Group®, Inc. (NASDAQ:DSPG), a leading global provider of wireless chipset solutions for converged communications, today announced the immediate availability of its new DHAN-J ULE module based on the company’s DHX91 ULE SoC. The DHAN-J module offers application developers a turn-key platform for Ultra Low Energy (ULE) nodes, both battery and AC-powered.
“We are thrilled to bring to market the latest ULE module in our portfolio, specifically built for robust IoT applications,” said Jochen Kilian VP Core Technology, at DSP Group. “The industry has demanded an ultra-reliable and congestion free solution for industrial and smart building IoT applications and the DHAN-J module will perfectly suit the needs of developers looking to bring the next generation of smart devices to market.”
With its complete hardware, SDK and simple development environment, the DHAN-J significantly shortens the development cycle for OEMs looking to gain a competitive time-to-market advantage in this fast-moving space. Built around the company’s DHX91 SoC, the module can be easily integrated into the smallest smart nodes and can serve as a wireless connectivity channel for applications running on external MCUs, or act as a standalone solution using DHX91’s internal processor. Furthermore, the module has FCC, IC and ETSI regulatory certification, allowing the developer to surpass the hurdles of the RF certification process and significantly shorten the product development cycle.
Applications of DHAN-J are targeted to smart cities and industrial environments but can also be used for home automation, security, monitoring, metering and healthcare. Developers appreciate the simplistic interface for customers as a selling point for their ready-to-use applications, and end users benefit from DECT’s outstanding wireless range and ULE’s lowest power consumption.
“Our new DHAN module offers all the benefits of ULE, including an interference-free band, full home coverage and voice features,” said Jan Abelev, CVP ULE Product Marketing. “The DHAN-J module provides the means for developers to easily integrate the best IoT RF technology on the market, alleviating the need for extensive knowledge of the ULE standard and certifications, reducing effort, cost and development time.”
The new IoT module will be presented at the upcoming ISC West in Las Vegas April 11-13, 2018 at DSP Group’s private meeting room. For an invitation, please contact [email protected]
DSP Group’s DHAN-J module (DHX91-DM) is available for immediate purchase. For more information, please visit DSP Group site (www.dspg.com) or designated distributors.
For more information about DSP Group or its line of wireless connectivity solutions including the new DHAN-J, please visit the company’s website.
About DSP Group
DSP Group®, Inc. (NASDAQ:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, at the office and on the go. For more information, visit www.dspg.com.
Contact:
Tali Chen
CVP Corporate Development & Chief Evangelist
DSP Group, Inc.
Tel: +1(408) 240-6826
[email protected]


Rio Tinto Signs Interim Agreement With Yinhawangka Aboriginal Group Over Pilbara Mining Operations
Evercore Reaffirms Alphabet’s Search Dominance as AI Competition Intensifies
Moore Threads Stock Slides After Risk Warning Despite 600% Surge Since IPO
Coca-Cola’s Costa Coffee Sale Faces Uncertainty as Talks With TDR Capital Hit Snag
ANZ Faces Legal Battle as Former CEO Shayne Elliott Sues Over A$13.5 Million Bonus Dispute
China Adds Domestic AI Chips to Government Procurement List as U.S. Considers Easing Nvidia Export Curbs
Mizuho Raises Broadcom Price Target to $450 on Surging AI Chip Demand
Microsoft Unveils Massive Global AI Investments, Prioritizing India’s Rapidly Growing Digital Market
Azul Airlines Wins Court Approval for $2 Billion Debt Restructuring and New Capital Raise
Intel’s Testing of China-Linked Chipmaking Tools Raises U.S. National Security Concerns
Samsung SDI Secures Major LFP Battery Supply Deal in the U.S.
Nvidia Develops New Location-Verification Technology for AI Chips
United Airlines Flight to Tokyo Returns to Dulles After Engine Failure During Takeoff
SK Hynix Considers U.S. ADR Listing to Boost Shareholder Value Amid Rising AI Chip Demand
Apple App Store Injunction Largely Upheld as Appeals Court Rules on Epic Games Case
Trump’s Approval of AI Chip Sales to China Triggers Bipartisan National Security Concerns
Gulf Sovereign Funds Unite in Paramount–Skydance Bid for Warner Bros Discovery 



