Build 2016, Microsoft’s major developer conference for Windows, Windows Phone, Microsoft Azure and other technologies, is scheduled to be held between March 30 and April 1 in San Francisco.
“Build is back in San Francisco, Mar 30 – Apr 1! Developers, join us to see the future of Microsoft and technology”, Microsoft’s chief developer evangelist Steven Guggenheimer tweeted on Friday.
According to NDTV Gadgets, the company is expected to share the progress made in Windows 10. Also, rumor mill suggests that Windows 10 Redstone, the next major update to its operating system, might be unveiled at the event.
Moreover, the company is also expected to reveal details on HoloLens, a VR headset - the first fully untethered, holographic computer that enables high definition holograms to integrate with the real world. Microsoft said in October that it will start shipping the device to developers in the first quarter of 2016.
Build 2015 was held this year at the Moscone Center, San Francisco from April 29 to May 1. It largely aimed at guiding developers around Windows 10.


Elon Musk’s SpaceX Acquires xAI in Historic Deal Uniting Space and Artificial Intelligence
SpaceX Pushes for Early Stock Index Inclusion Ahead of Potential Record-Breaking IPO
Nvidia, ByteDance, and the U.S.-China AI Chip Standoff Over H200 Exports
Elon Musk’s Empire: SpaceX, Tesla, and xAI Merger Talks Spark Investor Debate
Baidu Approves $5 Billion Share Buyback and Plans First-Ever Dividend in 2026
Instagram Outage Disrupts Thousands of U.S. Users
Anthropic Eyes $350 Billion Valuation as AI Funding and Share Sale Accelerate
Oracle Plans $45–$50 Billion Funding Push in 2026 to Expand Cloud and AI Infrastructure
Nvidia Nears $20 Billion OpenAI Investment as AI Funding Race Intensifies
Nvidia Confirms Major OpenAI Investment Amid AI Funding Race
TSMC Eyes 3nm Chip Production in Japan with $17 Billion Kumamoto Investment
Jensen Huang Urges Taiwan Suppliers to Boost AI Chip Production Amid Surging Demand
Sony Q3 Profit Jumps on Gaming and Image Sensors, Full-Year Outlook Raised
Tencent Shares Slide After WeChat Restricts YuanBao AI Promotional Links
SoftBank and Intel Partner to Develop Next-Generation Memory Chips for AI Data Centers 



