Dublin, July 24, 2017 -- The "Key IoT technologies: Unlocking the IoT Potential" report has been added to Research and Markets' offering.
This report identifies the emerging IoT technologies.
For each of them, it also analyses their:
- Operating principle including advantages and drawbacks
- Drivers and barriers
- Adoption and related impacts for:
- Verticals (both device manufacturers and end users)
- Main IoT solution providers along the value chain
Geographic area and actors
World Actors:
- AT&T
- Cubic Telecom
- Gemalto
- Global M2M Association
- Samsung
Slideshow
Vertical development
IoT Technologies
- eUICC - the embedded SIM
- 6LoWPAN
- (Unlicensed) LPWAN
- Cellular IoT (licensed LPWA)
- LWM2M
- MQTT
- Big data
Market analysis
- Drivers & barriers
- Adoption of IOT technology will be very fast, and heterogenous
Finally, it also provides market estimates and forecasts in terms of annual shipments, for each technology at worldwide levels.
Key Topics Covered:
1. Executive Summary
2. Methodology & definitions
2.1. General methodology of reports
2.2. Market assessment and forecasts
2.3. Overall overview of main technologies
3. Hardware technologies: embedded SIM
3.1. Operating principle
3.2. Pros and cons
3.3. Drivers and barriers
3.3.1. Drivers
3.3.2. Barriers
3.4. Vertical adoption
3.4.1. Parts manufacturers
3.4.2. End users
3.5. Main solution providers
3.5.1. SIM card manufacturers
3.5.2. Module manufacturers
3.5.3. Telcos
3.5.4. Platform providers and IT players
4. Connectivity technologies
4.1. 6LoWPAN: pronounced Six-Low-Pan
4.1.1. Operating principle
4.1.2. Pros and cons
4.1.3. Drivers and barriers
4.1.4. Vertical adoption
4.1.5. Major solution providers
4.2. LPWA
4.2.1. Operating principle
4.2.2. Pros and cons
4.2.3. Drivers and barriers
4.2.4. Vertical adoption
4.2.5. Main solution providers
4.3. Cellular IoT
4.3.1. Technical description
4.3.2. Pros and cons
4.3.3. Drivers and barriers
4.3.4. Vertical adoption
4.3.5. Main solution providers
5. Middleware technologies
5.1. LwM2M/CoAP
5.1.1. Operating principle
5.1.2. Pros and cons
5.1.3. Drivers and barriers
5.1.4. Vertical adoption
5.1.5. Main solution providers
5.2. MQTT
5.2.1. Operating principle
5.2.2. Pros and cons
5.2.3. Drivers and barriers
5.2.4. Vertical adoption
5.2.5. Main solution providers
6. IT and software technologies: big data and analytics
6.1. Operating principle
6.1.1. Definition
6.1.2. State of the art
6.1.3. Perspective and future developments
6.2. Pros and cons
6.3. Drivers and barriers
6.4. Vertical adoption
6.4.1. Main impacts
6.4.2. Object manufacturers
6.4.3. End Users
6.5. Main solution providers
6.5.1. Module manufacturers
6.5.2. Telcos
6.5.3. IT players
7. Markets and forecasts
7.1. Synthesis
7.2. Market development factors
7.2.1. Drivers
7.2.2. Barriers
7.3. Market forecasts
Companies Mentioned
Players marked ** are subject of a dedicated case study. Other players are either listed, or may be described in extenso, in the narrative texts.
- Advantech
- Aerea
- Altice
- ARM
- Arqiva
- AT&T **
- Atmel
- Audi Connect
- Autodesk
- AWS
- Bell Canada
- Bluewind
- Bosch IoT suite
- Bouygues Telecom
- Cell Labs
- Cellnex (Abertis)
- China Mobile
- China Telecom
- China Unicom
- Cisco Jasper
- Clear Channel
- Comcast
- Connected Finland
- Cubic Telecom **
- Deutsche Telekom
- Digimondo
- DOCOMO
- du
- Elecsys
- Enedis
- Enexis
- Engie
- Ericsson
- Etisalat
- Eurotech SCADA
- EVRYTHNG
- Facebook
- FastNet
- Flukso
- Freescale
- G&D
- GE Predix
- Gemalto **
- Global M2M Association**
- Google Nest
- GSMA
- HPE Universal IoT
- Huawei
- IBM
- IDEO Caraibes
- Ingenu
- Intel IoT platform
- IO Connect
- IoT Denmark
- IotNet Mexico
- KDDI
- KPN
- KT
- LG U+
- Libelium
- LIFX
- Linear Technologies
- Linky
- LoRa
- Maven
- Microsoft Azure
- NarrowNet
- NETTROTTER
- Nokia
- NXP
- Oberthur
- OMA
- OmanTel
- Oracle IoT cloud
- Orange
- Phaxsi
- Philips
- Proximus
- PTC ThingWorx
- ReMake Electric
- RMS.lu
- Samsung **
- Sasken Telematics
- Schneider CnM
- Schneider Electric
- Semtech
- Senaptic
- Senet
- Shaspa
- Sierra
- SIGFOX
- SingTel
- SK Telecom
- SoftBank
- STMicroelectronics
- Swisscom
- Tata
- Telecom Italia Mobile
- Telefónica
- Telenor
- Telensa
- TeliaSonera
- Telit
- Telstra
- Telus
- TEPCO
- Texas Instruments
- The Lace Network
- TheThings.iO
- Thingworx
- Thinxtra
- T-Mobile
- Toshiba
- U-Blox
- Vensure
- Verizon
- Visteon
- VITI
- Vodafone
- VT Networks
- Webtech
- Weightless
- WND
- Zebra Technologies
For more information about this report visit https://www.researchandmarkets.com/research/bmllc8/key_iot
CONTACT: Research and Markets
Laura Wood, Senior Manager
[email protected]
For E.S.T Office Hours Call 1-917-300-0470
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U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Internet of Things and M2M


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